Mechanical Program Lead Engineer

Lam India Global Hardware Technology India
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Mechanical Program Lead Engineer

Date:  Jul 16, 2026

Location: 

Bangalore, IN-Bangalore, IN

Req ID:  201521

Worker Category:  On-site Flex

The group you’ll be a part of

WETS Deposition group at Lam India Global Hardware Technology (LIGHT) is hiring a Mechanical Program Lead Engineer for its product development engineering team. 

The impact you’ll make

As a Mechanical Program Lead Engineer, you will lead the design, development, and technical ownership of complex mechanical and electro-mechanical subsystems for wafer fabrication equipment. You will drive early feasibility and architecture decisions, execute detailed design and validation, and ensure robust release to manufacturing through disciplined requirements, risk management, and cross-functional execution. This role partners closely with global engineering, program, and supplier teams to deliver reliable, cost-effective, and serviceable hardware for WETS Deposition product development programs.

What you’ll do

  • Design and develop substrate holder involving vaccum/mechaical/pneumatic subsystems for WETS NPD tools
  • Apply engineering first principles to solve structural, thermal and fluid dynamics problems
  • Design components using plastic and polymer materials for wet and chemical environments
  • Perform OEM component selection (eg: valves, regulators, fittings, tubing, and sensors)
  • Own subsystem delivery from concept through qualification and release
  • Drive issue resolution using structured problem‑solving methods (5‑Why, Fishbone, Pareto)
  • Develop, conduct and mentor feasibility studies and test plans to characterize and validate design performance.
  • Collaborate with CFTs such as Process, Electrical, Product Support, Supply Chain, and Manufacturing teams
  • Maintain clear documentation of designs, calculations, risks, and decisions

Who we’re looking for

Minimum Qualifications:

  • Bachelor’s degree in Mechanical Engineering or related field with 8+ years of experience; or Master’s degree with 6+ years’ experience; or equivalent experience.
  • Excellent communication, both written and verbal, and technical presentation skills.
  • Highly proficient in 3D CAD tools such as Solid Edge, Siemens NX.
  • Hands-on experimental and design background coupled with solid engineering skills.
  • Excellent leadership skills in team planning, strategizing, innovation
  • Decision making experience to solve problems related to Engineering and Business processes in collaboration with cross functional team in a matrixed organization

Preferred qualifications

  • Strong mechanical design fundamentals with hands-on ownership from concept through release for high-reliability hardware.
  • Expertise selecting materials and finishes for semiconductor environments (metals, ceramics, quartz, polymers, coatings) with contamination and thermal considerations.
  • Proficiency in engineering analyses: structural/FEA, thermal/heat transfer, stress and vibration, and fluid/gas flow as applicable.
  • Experience with requirements definition and verification/validation planning at system and subsystem level.
  • Working knowledge of DoE, FMEA, and DfX (cost, manufacturability, assembly, reliability, safety, testing, and serviceability).
  • Strong documentation discipline aligned with Lam/SEMI practices, including GD&T and configuration control.
  • Structured problem-solving experience (RCCA, 8D, 5-Why, Fishbone) with a track record of closing issues with data.
  • Broad manufacturing knowledge (machining, sheet metal, welding, polymers) and exposure to additive manufacturing.
  • Strong communication and stakeholder management skills; ability to influence across teams and drive decisions in design/program reviews.

Our commitment

 

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

Job Segment: Thermal Engineering, Manufacturing Engineer, Supply Chain, Mechanical Engineer, Engineering Manager, Engineering, Operations

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