SR R&D/PRODUCT DVL ENGINEER

TE Connectivity Shanghai, China
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Job Description

Job Title:  SR R&D/PRODUCT DVL ENGINEER

Posting Start Date:  3/24/26

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. 

Job Description: 

Job Overview

Leads small and medium sized projects and develops product families.

Job Requirements

  • Subject matter expert in signal integrity design, simulation and validation activities through product development cycles
  • Establishing signal integrity design performance/functional requirements for new products
  • Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
  • Performing PCB design schematic and layout reviews
  • Creating actionable recommendations based upon design reviews and simulation results
  • Guiding connector design and component qualifications from a signal integrity standpoint.  Making data driven decisions about the product functionality and areas for improvement.

What your background should look like

  1. Bachelor’s degree in Electrical Engineering or equivalent work experience
  2. 5+ years of relevant work experience in electrical design, RF design, or PCB design
  3. Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
  4. A solid understanding of electromagnetic theory and electrical circuit behavior
  5. Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
  6. Familiarity with printed circuit board design, fabrication and assembly.
  7. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers.
  8. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
  9. Individual must be highly motivated, a quick learner, and able to work independently.

 

 Nice to Have Skills/Experience:

  1. Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system
  2. Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems)
  3. Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English
  4. Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction.
  5. SixSigma methodologies or other strong data analytics background.
  6. Printed circuit board design, fabrication and assembly (Altium, AutoCAD)
  7. Experience in project leadership, especially as it applies across design, development & manufacturing teams
  8. Test equipment (oscilloscope, vector network analyzer, BERT)
  9. Signal conditioning techniques (equalization, amplification)
  10. Direct customer design and support experience
  11. Application and test knowledge of high-speed devices and equalization techniques

Competencies

SET : Strategy, Execution, Talent (for managers)

Job Locations:

BUILDING 5, 1F-8F, NO.1528 GUMEI ROAD
SHANGHAI, Shanghai 200233
China

Posting City:  SHANGHAI

Job Country:  China

Travel Required:  Less than 10%

Requisition ID:  149783

Workplace Type:  Onsite

External Careers Page:  Engineering & Technology

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